Heat sink
Compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages.
Press extrusion processing to improve heat dissipation in applications Our press extrusion processing heat sink line is an ideal solution for enhancing heat dissipation in low and high power board-level designs. It is compatible with TO-218, TO-220, TO-252, and TO-263 transistor package types and is available in various standard shapes and sizes. Our aluminum heat sinks can be easily measured under four conditions of thermal resistance, making it easy to select the best extrusion or press for natural convection or forced air cooling systems.
- Company：Same Sky Japan
- Price：Other
